JPH0148652B2 - - Google Patents
Info
- Publication number
- JPH0148652B2 JPH0148652B2 JP58011847A JP1184783A JPH0148652B2 JP H0148652 B2 JPH0148652 B2 JP H0148652B2 JP 58011847 A JP58011847 A JP 58011847A JP 1184783 A JP1184783 A JP 1184783A JP H0148652 B2 JPH0148652 B2 JP H0148652B2
- Authority
- JP
- Japan
- Prior art keywords
- sio
- film
- pattern
- photoresist
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1184783A JPS59136935A (ja) | 1983-01-27 | 1983-01-27 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1184783A JPS59136935A (ja) | 1983-01-27 | 1983-01-27 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59136935A JPS59136935A (ja) | 1984-08-06 |
JPH0148652B2 true JPH0148652B2 (en]) | 1989-10-20 |
Family
ID=11789108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1184783A Granted JPS59136935A (ja) | 1983-01-27 | 1983-01-27 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59136935A (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61226942A (ja) * | 1985-04-01 | 1986-10-08 | Matsushita Electronics Corp | 半導体集積回路の素子間分離方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5649526A (en) * | 1979-09-29 | 1981-05-06 | Toshiba Corp | Manufacture of semiconductor device |
JPS5718327A (en) * | 1980-07-09 | 1982-01-30 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
JPS5732640A (en) * | 1980-08-06 | 1982-02-22 | Mitsubishi Electric Corp | Production of semiconductor device |
JPS5768035A (en) * | 1980-10-15 | 1982-04-26 | Toshiba Corp | Manufacture of semiconductor device |
-
1983
- 1983-01-27 JP JP1184783A patent/JPS59136935A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59136935A (ja) | 1984-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58210634A (ja) | 半導体装置の製造方法 | |
JPH07118504B2 (ja) | 半導体デバイスの製造法 | |
US5397733A (en) | Method for the construction of field oxide film in semiconductor device | |
JPH0748491B2 (ja) | 集積回路半導体デバイスの製造方法 | |
JPH0427702B2 (en]) | ||
JPH0148652B2 (en]) | ||
JPH04150030A (ja) | 半導体装置の製造方法 | |
JPS586306B2 (ja) | ハンドウタイソウチノ セイゾウホウホウ | |
JPH0427703B2 (en]) | ||
JPS63228732A (ja) | 半導体装置の製造方法 | |
JPH0346977B2 (en]) | ||
JPS6387741A (ja) | 半導体装置の製造方法 | |
JPH0226783B2 (en]) | ||
JPS60258964A (ja) | 半導体装置の製造方法 | |
JPH079930B2 (ja) | 半導体装置の製造方法 | |
JPH0478013B2 (en]) | ||
JP2570729B2 (ja) | 半導体装置の製造方法 | |
JPH0194623A (ja) | 多層配線半導体装置の製造方法 | |
JPS62104078A (ja) | 半導体集積回路装置の製造方法 | |
JPS58115834A (ja) | 半導体装置の製造方法 | |
JPH035656B2 (en]) | ||
JPH0458538A (ja) | 半導体装置の製造方法 | |
JPS60128635A (ja) | 素子分離領域の形成方法 | |
JPS58158968A (ja) | 半導体装置の製造法 | |
JPS6279625A (ja) | 半導体装置の製造方法 |